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Product quality and clean room and clean room requirements


Clean technology is continuously developed based on the development of science and technology and in order to solve the many effects of dust particles in the production environment of industrial products on product quality. Today's global science and technology are developing rapidly, and the development of information technology and biotechnology is changing with each passing day. The cleanliness of information technology products in clean rooms and clean workshops has been refined, and vLsI has been updated very quickly. It takes less than two years to cross a grade. The characteristic size of v base I has reached the deep sub-micron level. The development of v151 has driven clean technology. When people talk about the production of v15I, they naturally ask how much dust-free production environment is. The cleanliness level of the clean room and clean room? What is the particle size of the suspended particles to be controlled? What method is adopted as a means of purifying the air and purifying the clean room and clean room? The development of biotechnology has also greatly promoted clean room. The development of clean technology in clean rooms and clean rooms, especially since the 1990s, the development of new biological products and medical products and the development of production technologies at home and abroad The development of microbial pollution control technology, anti-virus pollution and infection technology has made great progress, and clean rooms and workshops have basically adapted to the needs of the development of biotechnology. In short, the development of science and technology today, the research, production and production of many high-tech products to ensure the high quality and high yield of these products are closely related to the development of clean technology in clean rooms and clean rooms. The development mainly depends on the improvement of the integration, that is, the reduction of the characteristic size. The clean room and clean room are the prediction of the future development trend of integrated circuits by the International Semiconductor Industry Association (51A) and the control requirements for dust particles in a clean production environment. . Clean room and clean room are sIA's prediction of future integrated circuit development trends and the content of impurities such as H20, 02, co, cq, cH4 allowed in ordinary gases (Hz, z, q, from) in the production process And dust particle content requirements. It is understood that the line width is o. The 09P "VLSI chip has been developed and produced, and it can be seen that the development and production of vLsl is faster than predicted.
In the past, the size of controlled particles in the air of clean rooms and clean rooms was generally considered to be based on 36 of the integrated circuit's feature size. However, with the increase of integration, the feature size continues to shrink and the clean production environment control technology improves. And other factors, some data introduction can be considered according to the size of the feature size, in 1 has gradually been recognized by colleagues in various countries. Now, the data in clean room and clean room are uniformly converted into 0.14 particles, and the maximum allowable value of four particles on a unit area wafer is shown in Table 2-5. It can be seen from the data of the clean room and clean room that when the yield of the 64G ultra-large-scale integrated circuit is 80%, 10 4250 wafers are on o. 1Pm air particles are only allowed o. 25, which basically does not allow more than 1 lPm of air particles to exist. Can I calculate the airborne dust concentration c (pc / m3) after obtaining the maximum allowable value of air particles E (pc / m2) on a chip per unit area? Comparison of the sedimentation process of particles in the air in a clean room and a clean room It is complicated, and it is related to many factors such as the air flow pattern, air speed, silicon processing technology and equipment configuration in the clean room and clean room. According to the relevant data, if we only compare the production status of chip processing, After excluding all the same conditions, the allowable dust concentration in the air of the clean room and clean room is only related to the exposure time of the chip in the air and the maximum allowable value of air particles per unit area of the chip. After calculation, it can be obtained When the yield rate of D AM integrated circuits with an integration degree of 1M to 64G reaches 90%, the chip processing area will include umbrellas and clean rooms and clean rooms.

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